Since the introduction of Artificial Intelligence (AI), every company around the world are making their technologies based on AI. Now, the American multinational company “Intel Corporation” is powering chips with Artificial Intelligence. On August 20, Intel reveals the details of upcoming high-performance AI based Nervana neural network processor with the NNP-T for training and NNP-I for interface.
According to the Intel Newsroom,
“To get to a future state of ‘AI everywhere,’ we’ll need to address the crush of data being generated and ensure enterprises are empowered to make efficient use of their data, processing it where it’s collected when it makes sense and making smarter use of their upstream resources. Data centers and the cloud need to have access to performant and scalable general purpose computing and specialized acceleration for complex AI applications. In this future vision of AI everywhere, a holistic approach is needed—from hardware to software to applications.”
– Naveen Rao, Intel vice president and general manager, Artificial Intelligence Products Group”
These are extremely helpful in many ways like turning data into information and then into knowledge requires hardware architectures and complementary packaging, memory, storage and interconnect technologies that can evolve and support emerging and increasingly complex use cases and AI techniques. Because Intel Nervana NNPs are built from scratch to provide their customers best with focus on AI.
Intel Nervana NNP-T (Neural Network Processor): It extend the boundaries of deep learning training. It is built to prioritize two key real-world considerations: training a network as fast as possible and doing it within a given power budget.
Intel Nervana NNP-I: It is built for specifically interface and is designed to accelerate deep learning deployment at scale, introducing specialized leading-edge deep learning acceleration while leveraging Intel’s 10nm process technology with Ice Lake cores to offer industry-leading performance per watt across all major datacenter workloads.
In addition to these, Intel also released details about Lakefield. It is the first product with 3D stacking and IA hybrid computing architecture for a new class of mobile devices. You can view the presentation for additional technical detail into Lakefield’s architecture and power attributes. You can also read the press release by Intel for more details here.